Sisällysluettelo:
“…Wu (United Microelectronics Corp) -- P46 Measurements of Normal and Friction Forces during Brush Scrubbing / Kenya Nishio, Yoshitaka Hara, Toshiyuki Sanada, Hirokuni Hiyama, Akira Fukunaga (Shizuoka Univerisity, Ebara Corporation) -- P47
Atomic scale flattening of gallium nitride substrate grown by Na flux method applying catalystreferred etching / Wataru Yamaguchi, Shun Sadakuni, Ai Isohashi, Hiroya Asano, Yasuhisa Sano,Mamoru Imade, Mihoko Maruyama, Masashi Yoshimura, Yusuke Mori, Kazuto Yamauchi (Osaka University) -- P49 Degradation Behavior of Ceria-based Abrasives Slurry during Glass Polishing / Koichi Kawahara, Toshimasa Suzuki, Seiichi Suda (Japan Fine Ceramics Center, Shizuoka University) -- P50 Planarization of brittle materials by laser assisted machining / Hironori Yamashida, Hidetoshi Takeda, Hideo Aida (Namiki Precision Jewel) -- P51 A Study on
Swing-Arm Conditioning for Enhancing Pad Lifetime in CMP / Hyunseop Lee, Dasol Lee, Haedo Jeong, Sangjik Lee (Tongmyong University, Pusan National University, Korea Institute of Industrial Technology) -- P52 A Novel Pad Conditioner and Pad Roughness Effects on Tungsten CMP / Donghyun Lim, Hojoong Kim, Bongyoung Jang, Honglae Cho, Junyong Kim, Hasub Hwang (SAMSUNG Electronics)…”
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