Solder-filled anisotrotropic conductive adhesives in electronic interconnections
Solder-filled anisotrotropic conductive adhesives in electronic interconnections
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| Physical Description |
32, [39] sivua : kuvitettu |
|---|---|
| Language |
English |
| Language of Original Work |
English |
| Item Description |
Tiivistelmä ja 5 erip. |
| Publisher |
Espoo :
TKK,
1996.
|
| Dissertation Note | Väitöskirja : Espoo : Teknillinen korkeakoulu |
| Classification |