Effect of microstructural characteristics on mechanical properties of SnAgCu solder joints
Effect of microstructural characteristics on mechanical properties of SnAgCu solder joints
Sparad:
| Fysisk beskrivning |
VIII, 47, [50] sivua : kuvitettu ; 25 cm |
|---|---|
| Språk |
engelska |
| Originalverkets språk |
engelska |
| Utgivare |
Tampere :
Tampere University of Technology,
2007
|
| Lärdomsprov | Väitöskirja Tampereen teknillinen yliopisto |
| Serie | Publication / Tampere University of Technology, ISSN 1459-2045; 676. |
| Klassifikation | |
| Tillverkare | (Tampereen Yliopistopaino) |
| Mer information | Janne Sundelin |
| ISBN |
978-952-15-1840-9 nidottu |