For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.